B-718 is constructed with a static dissipative adhesive. This product has adhesive surface resistivity values in the recommended range for dissipative ESD packaging materials.
B-718 has a low profile (1 mil) film allowing for easier use in processes which demand thin and/or lighter weight label materials. Preheat can be employed to further enhance print permanence in the case of extreme solvent and/or abrasion exposure.
B-718 is designed to withstand multiple cycles of harsh condition washes for printed circuit boards.